UL ISSP operates a microfluidics pilot line enabling translation from rapid prototyping to scalable thermoplastic manufacturing for parts up to 12 g. Early-stage devices are fabricated using a COC–OSTE–COC material platform, combining micromachined COC substrates with OSTE-based bonding and functional integration for fast design iteration and testing. Validated geometries are subsequently transferred to COC injection moulding for reproducible higher-throughput fabrication.